Hardware Engineering Intern – PCB Design & Failure Analysis — Tesla
Palo Alto, CA | September 2026 – December 2026
- Engineered custom PCBAs and modular bed-of-nails test fixtures from schematic capture through assembly and bring-up, routing 120+ probe points to reach 94% nodal access for structural test coverage and manufacturing validation
- Developed automated test software for Keysight i3070 ICT and x1149 boundary-scan platforms, using Python to sequence execution, parse parametric measurements, and log test records on high-volume automotive telemetry boards
- Executed root-cause failure analysis using oscilloscope profiling, X-ray, and microscopy, tracing intermittent power rail shorts to flexure-induced MLCC cracking during fixture actuation, prompting a fixture redesign that eliminated board flex failures






